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Guangzhou Mankun Electronic Co., Ltd. is a professional in the designing, and producing LED modules, LED strips, and finish LED products.
4 Years
| Ask Lasest Price | |
| Brand Name : | MANKUN |
| Model Number : | 19383 |
| Certification : | UL,CE,ROSH |
| Price : | Negotiation |
| Payment Terms : | Negotiation |
| Supply Ability : | 100000 Piece/Pieces per Month |
| Delivery Time : | 5-25 work days |
High Power SMD5050 DOB AC LED Module Driverless Custom Square Shape
Custom 5050 Square Ac Led Module 220v Driverless DOB High Power Smd Led PCBA
Product Description
Model | MK16H1-126x50-19383 |
Beam angle | 25/30x80/60/90/120/157x85degree |
Lens size | 50x50x10.1mm |
LED CHIP | SMD 5050 |
Dense array of 96 LED | led street light |
Materical for lens | Optical grade PC |
Lens transmittance | 93% |
Work temperature | -40-120 degree |
Samples | Available |
Delivery time | 5-7 work days for 1-1000 pcs |
TECHNICIAL CAPABILITY:
Item | Technical Specification | ||
Standard | Advanced | ||
Number of Layers | 1-48 layer | 48-60 layer | |
Laminate | CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial. | Thermount | |
Laminate Brand | KB,Shengyi,Nanya,Isola,Goword,grace,Rogers, Arlon,Taconic,Ventec,Boyu | customer specify | |
Maximum board size | 610X915mm | 610x1060mm | |
Board thickness | 0.15-4.5mm | 0.13-6.0mm | |
Minimum line width | 4mils (1oz Cu finished) | 3mils(1oz Cu finished) | |
Minimum Line gap | 4mils(1oz Cu finished) | 3mils(1oz Cu finished) | |
Outer layer copper thickness | 1/3-12OZ | 12-16OZ | |
Inner layer copper thickness | 1/3-14OZ | 14-16OZ | |
Min. finished hole size (Mechanical) | 0.20mm | 0.15mm | |
Min. finished hole size (laser hole) | 0.075mm | 0.05mm | |
Aspect ratio | 10:01 | 12:1 | |
Solder Mask Types and brand | Nanya,Taiyo | customer specify | |
Solder Mask Color | Gloss & matte green | Red, Black, Yellow, Blue,white | |
Impedance Control Tolerance | 10% | 5% | |
Surface Treatment | Flash Gold | Au:1-3U'' | Au: 3U'' |
Immersion Gold | Au:2-4U'' | Au: 2-6U'' | |
Sn/PB HASL | Sn:100-1000U'' | Sn: 200-800U'' | |
Leadfree HASL | Sn:100-1000U'' | Sn: 200-800U'' | |
Immersion Silver | Ag: 0.15um-0.75um | / | |
OSP (Entek) | Thicknes: 0.20-0.50um | / | |
Hard Gold Finger | Au: 30U'' | Au:30-60U'' | |
Hard Gold Plating | Au-30U'' | Au:30-60U'' | |
Carbon ink | |||
Immsion Sn | Sn:0.8-1.2um | ||
V-Cut | V-cut degree | 30+/-5 degree | 20,45, 60 Degree |
Tol: +/-0.13mm | Tol: +/-0.10mm | ||
Chamfer | The angle type of the chamfer | 20,30, 45 Degree | / |
Plug via hole | Min. size can be plugged | 0.15mm | / |
Max. size can be plugged | 0.50mm | 0.70mm | |
Min. distance between the IC pads can keep SM bridge | 8mils | 7mils | |
Min. SM bridge for green soldermask | 4 mils | 3 mils | |
Min. SM bridge for black soldermask | 5mils | 4mils | |
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